The Durbin Group supports a wide range of rapid development and design capabilities but excels particularly in advanced cooling. We enable new frontiers in power density, performance, operating cost, and efficiency.
Durbin Group partners with some of the most innovative companies in the world to help create thermal management solutions for leading edge products. Click here to see how our collaboration with Nvidia produced the cooling system for the DGX Station A100.
Increased power density at the chip (<1000W), server rack (>100kW), and facility
Packaging constraints lifted, junction temperature reduced, increased heat flux, lower latency
Opens up system architecture degrees of freedom to enable next generation systems
Large growth for thermal load increases at each node in the system with no changes to hardware
Sealed system, no maintenance, no scaling, no microbial growth, no additives, dielectric fluid, long pump life
Reduced operating cost over all other thermal management methods
Significant energy savings from two-phase heat transfer and low pumping power